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Soldering Temperature Guide – Online Component & Tip Size

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Soldering Temperature Guide

Find the optimal soldering temperature, tip size, and tip shape for your component. Covers through-hole, SMD, BGA, connectors, and heat-sensitive parts with leaded & lead-free solder recommendations.

Quick Presets — Click to Select
0805 Resistor/Cap
Leaded · 310°C
QFP-64 MCU
Lead-Free · 370°C
USB-C Connector
Leaded · 340°C
BGA Rework
Lead-Free · 380°C
2.54mm Headers
Leaded · 330°C
Ground Plane
Lead-Free · 400°C
Recommended Temperature
370 °C 350–390°C
(662–734°F)
200°C260°C300°C340°C370°C400°C450°C
390°F500°F570°F640°F700°F750°F840°F
Tip Recommendation
█
Chisel
1.6–2.4 mm width
Solder Wire:
0.5–0.8 mm
Contact Time:
2–4 seconds
Key Tips
  • Preheat large boards to 80–120°C
  • Keep tip tinned between joints
  • Use flux for better wetting
  • Clean tip on brass wool regularly
  • For heat-sensitive parts, use heat sink clip
Quick Reference Table

Common component types with recommended soldering parameters

Component Type Package Leaded Temp Lead-Free Temp Tip Type Tip Size Time
SMD Resistor/Cap0402290–320°C340–370°CConical0.2–0.3 mm1–2s
SMD Resistor/Cap0603300–330°C345–375°CConical0.4–0.6 mm1–2s
SMD Resistor/Cap0805310–340°C350–380°CChisel0.8–1.2 mm2–3s
SMD Resistor/Cap1206320–350°C355–385°CChisel1.2–1.6 mm2–3s
SOIC / SOP1.27mm pitch320–350°C355–390°CChisel / Bevel1.2–1.6 mm2–3s
QFP0.5mm pitch330–360°C360–390°CBevel / Knife0.8–1.2 mm2–4s
QFNExposed pad340–370°C370–400°CHoof / Bevel2.0–3.0 mm3–5s
BGA (rework)0.8–1.0mm ball350–380°C375–410°CHoof / Hot AirN/A (hot air)Varies
Through-Hole ResistorAxial320–350°C360–390°CChisel1.6–2.4 mm2–4s
DIP IC2.54mm pitch330–360°C365–395°CChisel1.6–2.0 mm2–4s
Pin Headers2.54mm330–360°C365–395°CChisel1.6–2.4 mm2–3s
USB / HDMI ConnectorThrough-hole340–370°C370–400°CBevel2.4–3.5 mm3–5s
Battery TabNickel strip330–360°C360–390°CBevel2.0–3.0 mm2–3s
LED (heat-sensitive)3mm/5mm/SMD280–310°C320–350°CChisel1.0–1.6 mm1–2s
Ground PlaneLarge copper pour360–400°C380–420°CBevel (large)3.0–4.5 mm4–8s
Soldering Tip Shape Guide
Conical
Precision SMD
0402–0603
Chisel
General purpose
Most common
Bevel
Drag soldering
Large pads
Hoof
BGA/QFN rework
High heat capacity
Knife
Multi-lead IC
Bridging fix
Bent
Hard-to-reach
Tight spaces
Frequently Asked Questions

Everything you need to know about soldering temperatures and tip selection

What is the ideal soldering temperature for lead-free solder?

Lead-free solder (SAC305) typically requires 350–400°C (660–750°F). The higher melting point of 217–220°C means you need about 30–50°C more than leaded solder. Always start at the lower end and increase only if needed to avoid thermal damage to components and PCB pads.

How do I choose the right soldering tip size?

Match the tip width to the pad or lead width. For SMD components, the tip should be roughly the same width as the pad. For through-hole, use a tip about 60–80% of the pad diameter. Too small = poor heat transfer; too large = risk of bridging and damage to adjacent components.

What happens if soldering temperature is too low?

Cold solder joints occur — dull, grainy, and mechanically weak connections. The solder may not fully melt and wet the surfaces, leading to poor electrical conductivity and reliability issues. Cold joints often look lumpy and may fail intermittently.

What happens if soldering temperature is too high?

Excessive heat causes PCB pad lifting, component damage, excessive oxidation, burnt flux residue, and tip degradation. Sensitive components like LEDs, sensors, and ICs can be permanently damaged above their rated temperature. The solder may also become brittle.

How long should I hold the soldering iron on a joint?

For most joints, 1.5–4 seconds is sufficient. SMD passives: 1–2s; through-hole: 2–4s; large connectors/ground planes: 4–8s. If the joint doesn't flow within this time, your temperature is likely too low or the tip is too small. Prolonged heating damages components and PCB.

Why do my solder tips oxidize so quickly?

Oxidation accelerates at temperatures above 400°C (750°F). Always use the lowest effective temperature, keep the tip tinned with fresh solder when not in use, clean it on brass wool (not wet sponge for prolonged contact), and avoid leaving the iron idle at high temperature for extended periods.

Should I use leaded or lead-free solder?

Leaded solder (Sn63/Pb37) is easier to work with, melts at 183°C, and produces shinier joints — ideal for hobbyists and prototyping. Lead-free solder (SAC305) is required for RoHS compliance in commercial products sold in the EU and many regions. It requires higher temperatures and more skill.

How do I solder heat-sensitive components safely?

Use a heat sink clip on the lead between the joint and the component body. Reduce temperature to 280–320°C for leaded or 320–350°C for lead-free. Limit contact time to 1–2 seconds. For LEDs and sensors, consider using a temperature-controlled iron set to the lower end of the recommended range.

What tip shape is best for drag soldering QFP ICs?

A bevel (hoof) tip or knife tip works best for drag soldering multi-pin QFP and SOIC packages. The flat surface holds a small solder reservoir and glides smoothly across multiple pins. Use plenty of flux, set temperature to 350–380°C, and drag slowly for perfect results.

How do I solder large ground planes effectively?

Ground planes act as massive heat sinks. Use a large bevel tip (3.0–4.5mm), increase temperature to 370–420°C, preheat the board to 80–120°C if possible, and apply the tip for 4–8 seconds to allow the copper to reach soldering temperature. A higher-wattage iron (60W+) is recommended.

What is the difference between °C and °F in soldering?

The electronics industry primarily uses Celsius (°C). Common conversions: 300°C = 572°F, 350°C = 662°F, 400°C = 752°F. To convert: °F = (°C × 9/5) + 32. Most soldering stations display °C, but some North American models offer °F. This tool provides both units for convenience.

How do I know if my iron's temperature is accurate?

Use a soldering iron thermometer or tip temperature tester. Many budget stations display inaccurate temperatures — actual tip temperature can differ by ±30°C or more. Calibrate your station if it supports it, or use a separate thermometer to verify. This is especially critical for lead-free soldering.

Pro Tips for Perfect Soldering
Always tin a new tip before first use to prevent oxidation
Use 60W+ iron for ground planes and large connectors
Match solder wire diameter to component size (0.3–0.5mm for SMD)
Add extra flux — it improves wetting and reduces bridging
Preheat multilayer boards to reduce thermal shock
Store tips with a protective solder coating when not in use
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